Samsung Electronics Starts Mass Producing HBM2 Memory 9.6 Times Faster

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The successor to the groundbreaking first generation "Flarebolt", the Samsung Aquabolt HBM2 will deliver a whopping 2.4 gigabits per second (Gbps) of memory per pin, making it the industry's fastest DRAM performance and paving the way for even faster calculations on the latest supercomputers, AI solutions and enabling even more powerful graphics cards to come out on the market.

Samsung is among the companies developing and producing HBM2 and announced today it is starting mass production of its second generation HBM2, called Aquabolt.

Samsung's first 8GB HBM2 package offered a transfer rate of 1.6Gbps at 1.2V (and 2.0Gbps at 1.35V). The company's second generation HBM2 module (also known as "Aquabolt") now features the fastest DRAM data transmission speeds to date. By using four HBM2 packages, it is possible to achieve a 1.2TBps bandwidth, which is a 50 percent improvement compared to standard 1.6Gbps HBM2 chips. "We will continue to reinforce our command of the DRAM market by assuring a stable supply of HBM2 worldwide, in accordance with the timing of anticipated next-generation system launches by our customers".

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Samsung's new Aquabolt significantly extends the company's leadership in driving the growth of the premium DRAM market.

To achieve Aquabolt's unprecedented performance, Samsung has applied new technologies related to TSV design and thermal control.

Aimed to be used for supercomputing, AI, and graphics processing, the new 8GB HMB2 uses eight 8Gb HBM2 dies, connected in a vertical stack by using over 5,000 TSVs (Through Silicon Via's) per die. Using that many TSVs can cause collateral clock skew although Samsung was able to minimize the skew and boost chip performance in the process. The new chip design includes an increased number of thermal bums for stronger thermal control, as well as an additional protective layer at the bottom that provides an increased physical strength for the entire package.

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